| 持股明細(資料日期：2026/09/30) |
| 持股名稱 | 比例 |
| 台積電 | 3.36% |
| SAMSUNG ELECTRONICS CO LTD | 3.12% |
| SK HYNIX INC | 2.63% |
| US TREASURY BONDS 5.25% 15NOV2028 | 2.57% |
| ITALY (REP OF) 1.25% 1DEC2026 | 2.23% |
| BONOS Y OBLIG DEL ESTADO (REG S) 1.5% 30APR2027 | 2.21% |
| MEXICAN BONOS DESARROL 7.5% 03JUN2027 | 2.19% |
| FRANCE (GOVT OF) 1.75% 25JUN2039 | 2.18% |
| US TREASURY N/B 4.000000 % 31JUL2032 | 2.04% |
| POLAND GOVERNMENT BOND SER 0727 2.5% 25JUL2027 | 2.02% |
| JAPAN (GOVT OF) SER 113 2.1% 20SEP2029 | 2.00% |
| ITALY (REP OF) (REG S) 3.25% 01MAR2038 | 1.95% |
| BUNDESCHATZANWEISINGEN (REG S) (BR) 1.7% 15AUG2 | 1.79% |
| CHINA (GOVT OF) (REG S) (BR) 3.6% 27JUN2028 | 1.52% |
| MALAYSIA GOVERNMENT SER 226 3.237% 15MAR2029 | 1.44% |
| US TREASURY BOND 2.75% 15NOV2042 | 1.37% |
| U.S. TREASURY BONDS 5.5PCT DUE 15AUG2028 | 1.31% |
| US TREASURY N/B 4.000000 % 30APR2032 | 1.30% |
| US TREASURY N/B 3% 15MAY2045 | 1.25% |
| CHINA GOVERNMENT BOND (BR) (REG S) 4.15% 04DEC2 | 1.21% |
| REPUBLIC OF KOREA (REG) 2.75% 19JAN2027 | 1.17% |
| TENCENT HLDGS LTD | 1.12% |
| US TREASURY N/B 4.375% 15May2036 | 1.10% |
| UK (GOVT OF) (REGS) (REG) 3.75% 22JUL2052 | 1.08% |
| US TREASURY NOTE/BOND 1.5% 15FEB2030 | 1.05% |